Large reflux plant, the Friends of large reflow manufacturers, specializing in large-scale factory reflow, lead-free reflow soldering machines, reflow small, desktop reflow soldering machines, energy efficient reflow, the Friends of automation brand reflow soldering machine. Vacuum vapor phase reflow As electronic products (including microelectronics) development, a large number of small surface mount solder components have been widely used in products, traditional ordinary hot air reflow process has been far from meeting the production and quality of requirements, the use of advanced technology DENSO delay. Vacuum vapor phase reflow soldering system is an advanced electronic welding technology, high-end European and American Welding: automotive electronics, aerospace enterprises are mainly electronic welding technology means. And traditional reflow soldering technology electronic comparison, this new technology with high reliability, void-free solder joints, high packing density, strong anti-vibration, solder joint defect rate, good high-frequency characteristics, maintenance-free maintenance. Therefore, it is to improve the quality of welding products, increase productivity, solve product quality problems welding an effective method. Vapor phase reflow soldering is a large amount of heat by heat transfer medium vapor is condensed into liquid in the process of release for heating assemblies, rapidly increase the temperature of the assembly. For vapor phase soldering, the heat transfer coefficient of 300 -500W / m2K order of magnitude, and forced convection soldering (air or nitrogen) heat transfer coefficient is generally small, it is one of very few. Changes in state media (gas transition) process, the temperature on the surface of PCBA remain constant. Therefore, uniform heating components, regardless of the shape and design of the circuit board. However, due to the heat quickly, it must be taken to ensure that the heating rate must not exceed the solder paste and component suppliers recommended temperature - usually the highest per second 2 ℃ to 3 ℃. Select a moderate boiling liquid, it is possible that the maximum temperature of the circuit board and the control elements within a small temperature difference (ΔT) range. Advantages vapor reflow process is ΔT small, especially for lead-free solder, which is generally narrower process window. It also avoids the risk of excessive heating element appear, because the temperature of the printed circuit board and the component does not exceed the boiling point of the chosen liquid solder. Finally, because the liquid used in the welding process does not react chemically, then there is no need to weld the inert atmosphere. These are the three main advantages of gas-phase reflow soldering than forced convection oven stronger.