Shenzhen wave plant, Shenzhen professional wave soldering manufacturers, the Friends of the wave soldering manufacturers, specializing in brand wave soldering, wave soldering the Friends of automation brand manufacturers, the manufacturers of the best wave solder bridging or short-circuit PCB design is unreasonable, the pad pitch too narrow. DFM compliance with the design requirements. Cartridge Component plug pin irregular or crooked, has been close to or have already run between the front soldering pins. Cartridge Component pin aperture should be based on the PCB and assembly requirements forming, such as the use of short-inserted welding process requires the original pin exposed surface of the printed circuit board welding 0.8-3mm, requires member body upright when the cartridge. PCB preheat temperature is too low, due to the low PCB and component temperatures, when the original and PCB soldering heat, so that the actual welding temperature. According to PCB size, whether plywood, set the number of components, with or without mounting components such as preheating temperature. Soldering temperature is too low or belt speed is too fast, the viscosity of the molten solder is too large. Solder wave temperature of 250 ± 5 ℃, soldering time 3-5s. When the temperature is slightly lower, slower conveyor speed should be adjusted. Poor flux activity. Replace flux. Poor wetting, weld, welding ends Weld components, pins, PCB pads have oxidation or contamination, or PCB moisture. Component first come first use, do not store in a humid environment, do not exceed the prescribed use date. Cleaning of printed boards and to deal with the influx. Chip components ends metal electrode adhesion is poor or single-layer electrode, hat phenomenon generated at soldering temperatures. SMT three-tier structure of the tip when soldering components to withstand more than two consecutive 260 ℃ temperature shock wave. PCB design is unreasonable, the shadowing effect caused by weld wave soldering. DFM compliance with design requirements PCB warpage, PCB cocked position to make poor contact with the crest. PCB warpage less than 0.8-1.0% of the non-parallel sides of the belt, make contact with the PCB and the peaks are not parallel. Adjust the level. Crest is not smooth, wave height on both sides are not parallel, especially tin wave soldering machine electromagnetic pump spout when the oxide if blocked, will appear serrated peaks, likely to cause weld, Weld. Cleanup tin-nozzle. Poor flux activity, resulting in poor wettability. Replace flux. PCB preheat temperature is too high, so that the flux carbonation, loss of activity, resulting in poor wettability. Set appropriate preheating temperature